Call for papers

The IEEE International Symposium on Rapid System Prototyping (RSP) emphasizes design experience sharing and collaborative approach between hardware and software research communities from industry and academy. It considers prototyping as an iterative design approach for embedded hardware and software systems. The RSP series of symposium aim at bridging the gaps in embedded system design between applications, architectures, tools, and technologies to achieve rapid system prototyping of emerging software and hardware systems.

For its 26th venue, the Rapid System Prototyping symposium seeks original contributions related to this target, encompassing a wide scope ranging from formal methods for  the  verification  of  software  and  hardware  systems  to  case  studies  of  emerging embedded systems and technologies. The symposium proposes a two-day inspiring international forum for discussing the latest related innovations and research activities. The symposium program will include keynote speeches and technical papers on timely topics.

The RSP symposium continues as a part of the Embedded Systems Week, that will be held this year in Amsterdam, The Netherlands.
See for more details.

Suggested topics include, but are not limited to:

  • Rapid prototyping and emulation methods and tools
  • Specification models and methodologies for hardware/software systems
  • Emerging technologies, devices, boards, and applications
  • Prototyping experiences related to emerging technologies (memories, 3D integration, next generation wireless, Internet of Things)
  • Prototyping of embedded systems for real-time, low power, and flexibility
  • Middleware for embedded systems
  • Model-driven engineering and prototyping
  • Formal methods and verification/validation of embedded systems
  • Reliability and failure analysis for embedded systems
  • Embedded system virtualization
  • Virtual prototyping and platforms for embedded systems
  • Prototyping methods and tools for reconfigurable computing
  • Rapid design approaches for application-specific processors
  • MPSoC and GPU-based system design and challenges
  • Hardware platforms and approaches for simulations acceleration
  • Industrial experiences in embedded system prototyping

The program committee invites authors to submit original unpublished full papers. Authors of selected papers will be requested to prepare a final camera-ready manuscript for the symposium proceedings and must register and attend the conference for their paper to be published. Paper length should not exceed 7 pages and should use the standard IEEE format. Submission instructions as well as templates can be found on the RSP web site Accepted and presented papers will be included in the IEEE RSP 2014 symposium proceedings and published in IEEE Xplore.

Important Dates:

  • Abstract submission (extended): June 10, June 15, 2015
  • Paper submission (extended): June 15, June 22, 2015
  • Notification of Acceptance (extended): July 20, July 22, 2015
  • Final Camera Ready Manuscript due: August 28, 2015

For any related question, please contact:

Amer Baghdadi, Telecom Bretagne/Lab-STICC (

Fabiano Hessel, PUCRS (

Frédéric Rousseau, TIMA (


Electronics, Journal Special Issue

Best evaluated papers will have the opportunity to submit an extended version to an approved special issue of the journal Electronics, MDPI AG, (


Paper submission

Submission instructions as well as templates can be found on the RSP web site:

Electronically submit all papers using the following link: