Call for papers
The International Symposium on Rapid System Prototyping (RSP) emphasizes design experience sharing and collaborative approach between hardware and software research communities from industry and academy. It considers prototyping as an iterative design approach for embedded hardware and software systems. The RSP series of symposium aim at bridging the gaps in embedded system design between applications, architectures, tools, and technologies to achieve rapid system prototyping of emerging software and hardware systems.
For its 28th venue, the Rapid System Prototyping symposium seeks original contributions related to this target, encompassing a wide scope ranging from formal methods for the verification of software and hardware systems to case studies of emerging embedded systems and technologies. The symposium proposes a two-day inspiring international forum for discussing the latest related innovations and research activities. The symposium program will include keynote speeches and technical papers on timely topics.
The RSP symposium continues as a part of the Embedded Systems Week, that will be held this year in Seoul, South Korea.
See http://www.esweek.org for more details.
Suggested topics include, but are not limited to:
- Rapid prototyping and emulation methods and tools
- Specification models and methodologies for hardware/software systems
- Emerging technologies, devices, boards, and applications
- Prototyping experiences related to emerging technologies (memories, 3D integration, next generation wireless, Internet of Things)
- Prototyping of embedded systems for real-time, low power, and flexibility
- Hardware and software platforms for IoT systems
- Middleware for embedded systems
- Model-driven engineering and prototyping
- Formal methods and verification/validation of embedded systems
- Reliability and failure analysis for embedded systems
- Embedded system virtualization
- Virtual prototyping and platforms for embedded systems
- Prototyping methods and tools for reconfigurable computing
- Rapid design approaches for application-specific processors
- MPSoC and GPU-based system design and challenges
- Hardware platforms and approaches for simulations acceleration
- Industrial experiences in embedded system prototyping
The program committee invites authors to submit original unpublished full papers. Authors of selected papers will be requested to prepare a final camera-ready manuscript for the symposium proceedings and must register and attend the symposium for their paper to be published. Each technical paper must be associated with an author registration at full rate. Papers should not exceed 7 pages and should use the ACM two-column format. Submission instructions as well as templates can be found on the RSP web site http://www.rsp-symposium.org. Accepted and presented papers will be included in the RSP'2017 symposium proceedings and published in ACM and IEEE digital libraries.
Important Dates:
- Abstract submission (extended):
May 30, 2017,June 12, 2017 - Paper submission (extended):
June 7, 2017,June 14, 2017 - Notification of Acceptance:
July 17, 2017,July 21, 2017 - Camera-Ready Manuscript due:
Aug. 28, 2017,September 5, 2017
For any related question, please contact:
Sungjoo Yoo, Seoul National University (sungjoo.yoo@gmail.com)
Fabiano Hessel, PUCRS (fabiano.hessel@pucrs.br)
Frédéric Rousseau, TIMA (frederic.rousseau@univ-grenoble-alpes.fr)
Paper submission
Submission instructions as well as templates can be found on the RSP web site: http://www.rsp-symposium.org
Electronically submit all papers using the following link: https://easychair.org/conferences/?conf=rsp-2017