28th International Symposium on Rapid System Prototyping (RSP)

Shortening the Path from Specification to Prototype

October 19-20, 2017, Seoul, South Korea

Part of ESWEEK'2017

 

 
News

Important Dates:

  • Abstract submission (extended): May 30, 2017, June 12, 2017
  • Paper submission (extended): June 7, 2017, June 14, 2017
  • Notification of Acceptance: July 17, 2017, July 21, 2017
  • Camera-Ready Manuscript due: Aug. 28, 2017, September 5, 2017

RSP'2017 to be part of ESWeek

Following the 2016 edition, RSP'2017 will be held in conjunction with ESWeek'17 in Seoul, South Korea. The symposium will take place in October 19-20, 2017.

Sponsoring

RSP'2017 Symposium is cosponsored by ACM (SIGBED, SIGDA, SIGMICRO) and IEEE (CAS, RS, CEDA).